Soldering apparatus

Details Soldering apparatus Soldering apparatus

1988-09-13

1989-05-23

Godici, Nicholas P.

Metal fusion bonding

Including means to apply flux or filler to work or applicator

228 36, 228 40, 228 47, 118423, 269 21, 269903, B23K 108, B05C 318

Patent

active

048322474

ABSTRACT:
A surface mounted chip soldering apparatus comprises a number of stations for fluxing and soldering the chip. For each station, the chip is carried by a suction pad in which is created a partial vacuum by a respective piston and cylinder mounted on a turret. The piston is upwardly spring biassed and operated in time and in sequence by pneumatically operated pistons to hold and to reject the chips as required for carrying out a soldering sequence.

REFERENCES:
patent: 3765591 (1973-10-01), Cook
patent: 4733462 (1988-03-01), Kawatani

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