Soldering apparatus

Details Soldering apparatus Soldering apparatus

1991-02-21

1997-03-18

Heinrich, Samuel M.

Metal fusion bonding

Including means to apply flux or filler to work or applicator

By partial or total immersion of work or applicator into liquid

228 43, 118423, 118428, H05K 334, B23K 37047

Patent

active

056114753

ABSTRACT:
Apparatus for applying solder to electrical or electronic components mounted in a horizontally oriented carrier, includes a solder bath, a pair of tracks (1,2) for guiding the carrier across the solder bath, and a device for urging the carrier along the tracks. The track has a first profiled region (12,19) for guiding a leading position of the carrier down towards the surface of the solder, and a second profiled region (16,20) longitudinally spaced from the first region, and laterally offset, for simultaneously guiding a trailing portion of the carrier down towards the surface of the solder, the profiles being substantially the same so that the carrier maintains its horizontal orientation while being moved vertically towards and away from the surface of the solder. The carrier moves on follower wheels which run along the tracks.

REFERENCES:
patent: 4285457 (1981-08-01), Kondo
patent: 4311265 (1982-01-01), Kondo
patent: 4489923 (1984-12-01), Barresi et al.
patent: 4677937 (1987-07-01), Tee
patent: 4700935 (1987-10-01), Winslow et al.
patent: 4717064 (1988-01-01), Popielarski et al.
patent: 4787550 (1988-11-01), Masuda et al.
patent: 4964560 (1990-10-01), Wharff
patent: 5130164 (1992-07-01), Hutchison et al.

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