Soldering apparatus

Details Soldering apparatus Soldering apparatus

1986-08-07

1987-10-20

Godici, Nicholas P.

Metal fusion bonding

Including means to apply flux or filler to work or applicator

By partial or total immersion of work or applicator into liquid

415170A, B23K 108

Patent

active

047008784

ABSTRACT:
In a soldering apparatus a pump pumps molten solder up into a tube to form a head of molten solder. Solder is fed from the tube through a conduit to a nozzle for a soldering operation. The pump comprises a rotatable shaft extending within the tube and an air tight seal is formed between the shaft and tube, above the level of the solder, to reduce the formation of dust of oxidized solder at the region of shear between the shaft and the solder surface.

REFERENCES:
patent: 4011980 (1977-03-01), Dvorak et al.
patent: 4131285 (1978-12-01), Denton
patent: 4337956 (1982-07-01), Hopper
patent: 4447001 (1984-05-01), Allen et al.
patent: 4587076 (1986-05-01), Bonhomme

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