Soldering apparatus

Details Soldering apparatus Soldering apparatus

1984-12-21

1987-03-24

Lin, Kuang Y.

Metal fusion bonding

Including means to apply flux or filler to work or applicator

By partial or total immersion of work or applicator into liquid

228 561, 2281801, 228260, B23K 306

Patent

active

046519165

ABSTRACT:
A soldering apparatus comprises a solder bath, an applicator for applying solder to a joint or the like to be soldered and a pump for pumping solder substantially continuously through the applicator. The applicator is movable vertically relative to the solder bath to solder a joint positioned above the bath.

REFERENCES:
patent: 3058441 (1962-10-01), Walker et al.
patent: 3566891 (1971-03-01), Koch, II
patent: 3598086 (1971-08-01), Kushima
patent: 3752383 (1973-08-01), Allen et al.
patent: 4072777 (1978-02-01), Schoenthaler
patent: 4113165 (1978-09-01), Ott

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