Metal fusion bonding – With means to juxtapose and bond plural workpieces
Patent
1999-12-06
2000-10-17
Ryan, Patrick
Metal fusion bonding
With means to juxtapose and bond plural workpieces
228 205, 228119, 228264, B23K 1018, B23K 3102
Patent
active
061317918
ABSTRACT:
A soldering and desoldering device incorporates a vacuum pickup device that assists the user in engaging mounted components for removal or in positioning and installing components. The device comprises a handpiece, a hot air tube extending from one end of the handpiece, and a vacuum pickup tube that extends through the hot air tube and a portion of the handpiece. An adjustment control protrudes from the handpiece and allows a user to control the position of the vacuum pickup tube via a sliding member coupled to the vacuum pickup tube. One or more springs disposed around the vacuum pickup tube are stretched or compressed to absorb excess force applied to the vacuum pickup tube and act to assist a user in mounting or dismounting a component from a substrate.
REFERENCES:
patent: 3561662 (1971-02-01), Duhaime et al.
patent: 3604610 (1971-09-01), Fortune
patent: 3818539 (1974-06-01), Fortune
patent: 3862468 (1975-01-01), Fortune
patent: 3912149 (1975-10-01), Fortune
patent: 3921249 (1975-11-01), Fortune
patent: 3965608 (1976-06-01), Schuman
patent: 3987954 (1976-10-01), Litt
patent: 4178496 (1979-12-01), Fortune
patent: 4187973 (1980-02-01), Fortune
patent: 4221017 (1980-09-01), Fortune
patent: 4274176 (1981-06-01), Undin et al.
patent: 4285091 (1981-08-01), Fortune
patent: 4292706 (1981-10-01), Fortune
patent: 4528746 (1985-07-01), Yoshimura
patent: 4659004 (1987-04-01), Fridman
patent: 4723353 (1988-02-01), Monforte
patent: 4767047 (1988-08-01), Todd et al.
patent: 4773582 (1988-09-01), Vella
patent: 4860438 (1989-08-01), Chen
patent: 4997121 (1991-03-01), Yoshimura
patent: 5135153 (1992-08-01), Hooriani
patent: 5195235 (1993-03-01), Mifuji
patent: 5280668 (1994-01-01), Fortune
patent: 5560531 (1996-10-01), Ruszowski
patent: 5890646 (1999-04-01), Tang et al.
Hakko Corporation
Ryan Patrick
Stoner Kiley
LandOfFree
Soldering and desoldering device with improved pickup device does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Soldering and desoldering device with improved pickup device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Soldering and desoldering device with improved pickup device will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-460148