Soldering alloy, cream solder and soldering method

Details Soldering alloy, cream solder and soldering method Soldering alloy, cream solder and soldering method

1997-01-31

1999-07-06

Ryan, Patrick

Metal fusion bonding

Process

With subsequent treating other than heating of bonded parts...

420561, 420562, B23K 3526, B23K 100

Patent

active

059187956

ABSTRACT:
The present invention relates to a soldering alloy composed mainly of Sn and free from lead which is a toxic substance. An addition of a small quantity of Ag to the soldering alloy can fine the alloy structure, minimize structural changes of the alloy and increase thermal fatigue resistance thereof. An addition of a small quantity of Bi to the soldering alloy lowers the melting point and improves the wettability thereof. Further, an addition of a small quantity of Cu restrains the growth of intermetallic compounds in the bonding interface between a copper land and the solder. Furthermore, an addition of a small quantity of In improves the elongation property and thermal fatigue resistance of the alloy.

REFERENCES:
patent: 16784 (1857-03-01), Blandy
patent: 5328660 (1994-07-01), Gonya et al.
patent: 5429689 (1995-07-01), Shangguan et al.
patent: 5520752 (1996-05-01), Lucey, Jr. et al.
patent: 5730932 (1998-03-01), Sarkhel et al.

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