Soldering

Details Soldering Soldering

1997-02-24

1999-08-24

Heinrich, Samuel M.

Metal fusion bonding

Including means to apply flux or filler to work or applicator

228 43, 228 495, B23K 300, B23K 3700

Patent

active

059414448

ABSTRACT:
The invention features soldering parts (e.g., printed circuit boards) by indexing the parts sequentially and continuously through a series of processing stations. Each of the series of processing stations includes at least one processing position, and the indexer indexes the parts from processing position to processing position. At different processing stations, the parts indexed into those processing stations are simultaneously processed.

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patent: 5176312 (1993-01-01), Lowenthal
AIRVAC Engineering, Co., Inc, PCBRM12 Printed Circuit Board Reflow Systems for Desoldering and Selectively Soldering Thru-Hole Multi-Leaded Components.
WENESCO, Inc., Wenesco Brochure.
Balog et al., "Surface-Mount Component Soldering", U.S. Serial No. 08,225,263, filed Aug., 1994, assigned to VLT Corporation, now abandoned.
Pullen et al., "Packaging Electrical Components", U.S. Serial No. 08,337,245, filed Nov. 10, 1994, assignedt to VLT Corporation, now USPN 5,644,103.

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