Soldered structure of fine wire, and method of and apparatus for

Details Soldered structure of fine wire, and method of and apparatus for Soldered structure of fine wire, and method of and apparatus for

1987-10-16

1989-10-31

Shaw, Clifford C.

Electric heating

Metal heating

For bonding with pressure

219 8518, B23K 100

Patent

active

048779369

ABSTRACT:
A fine wire whose conductor has a diameter of 100 .mu.m or less is welded on a conductor pattern. A part of the fine wire is formed into an exposed joint portion which is exposed out of a solder, but a part thereof which is nearer to an electric component than the exposed joint portion is buried in the solder layer.

REFERENCES:
patent: 3381081 (1968-04-01), Schalliol
patent: 3944777 (1976-03-01), Porat
patent: 3972463 (1976-08-01), Conlon et al.
patent: 4484054 (1984-11-01), Morino

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