Stock material or miscellaneous articles – All metal or with adjacent metals – Composite; i.e. – plural – adjacent – spatially distinct metal...
Reexamination Certificate
1997-08-07
2001-04-17
Thibodeau, Paul (Department: 1773)
Stock material or miscellaneous articles
All metal or with adjacent metals
Composite; i.e., plural, adjacent, spatially distinct metal...
C428S939000, C428S624000
Reexamination Certificate
active
06218030
ABSTRACT:
CROSS REFERENCE TO RELATED APPLICATION
This application is based upon and claims the benefit of priority of the prior Japanese Patent Applications Nos. 7-91862 filed on March 24, 1995 and 7-348710 filed on Dec. 18, 1995, the contents of which are incorporated herein by reference.
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to a soldering method. More specifically, the present invention relates to a method of electrically and mechanically connecting a substrate such as a rigid substrate and a flexible substrate, or a method of electrically and mechanically mounting on a substrate a connected member such as an IC (integrated circuit) chip, a discrete element and so on.
2. Related Arts
In recent years, there have been growing demands, in the installation of electronic products, for techniques of connecting and mounting components which are to be put in place at microscopic intervals. In the past, flux has been used in the soldering (which hereinafter implies an electrical connection by means of soldering and brazing). The flux has to be removed by cleaning after a connecting operation is finished since it is corrosive. In view of the environmental problems, however, there has been increasing restrictions imposed on the use of cleaning agents which contain CFCs (chlorofluorocarbons). A cleaning operation is sometimes difficult to be performed in the case of a soldering operation which has to be executed inside a package. Consequently, attempts have been made to implement soldering operations dispensing with cleaning operations by using low active flux which does not require the cleaning operation, or to perform a soldering operation in an inactive atmosphere without using flux if it has to be executed in a location which does not allow a cleaning operation. In the cases like these where low active flux is used or soldering operations are performed without using flux, it is difficult to secure a sufficient area for connection due to the effect of an oxide film on the surface of solder, which has given rise to such problems as the soldering being insufficient in strength and the connection being low in reliability, or voids occurring inside solder.
As an example of a soldering which will solve such problems as mentioned above, there is disclosed in Japanese Patent Laid Open No. 6-226485 a method in which a soldering is performed with a solder alloy coated with paraffin wax on its surface. Paying attention to the fact that the voids are caused by an oxide film, the technique has employed a method of covering solder with paraffin wax so as to prevent an oxide film from being grown on the surface of the solder.
Although the above-mentioned technique shows a method for preventing an oxide film from being formed, and for keeping and using solder under a condition in which there is no penetration of water, but it does not deal with soldering which has to be performed under a condition in which there is an oxide film formed on solder. In other words, soldering cannot be executed unless terminals have been solder-plated in advance as in the case of connections between terminals, and in the event of solder surface being oxidized, solder coated with paraffine wax cannot be used for connections between terminals.
SUMMARY OF THE INVENTION
It is an object of the present invention to provide a soldered product, which can secure a reliable connection by soldering.
To solve the above-mentioned problems, the soldered product according to the present invention has a first member on which a first connected portion is formed, a second member which is placed to face the first member. The second member has a second connected portion formed thereon. The second connected portion is electrically connected with the first connected portion via a connecting material composed of a soldering or brazing material. In the present invention, a layer including at least one type of hydrocarbon compound which is selected from a group comprising alkane, alkene and alkyne is formed at least in the periphery of the connecting material.
Therefore, because the connecting material is protected by the layer consisting of at least one type of hydrocarbon compound, durability of the connection due to the connecting material can be enhanced.
It is preferable that the connecting material is filled within a space surrounded by the first member, first connected portion, second member, second connected portion and connecting material. In this case, the periphery of the connecting material can be further reliably protected from pollutant or corrosive substances.
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Kondo Koji
Kurahashi Takashi
Miyake Toshihiro
Okumura Nozomu
Takagi Makoto
Nippondenso Co. Ltd.
Pillsbury & Winthrop LLP
Rickman Holly C.
Thibodeau Paul
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