Soldered joint

Electricity: conductors and insulators – Conduits – cables or conductors – Single duct conduits

Patent

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Details

174 94R, 361408, H05K 100

Patent

active

040643565

ABSTRACT:
A soldered joint between a thin flat conductive lead and a flat conductive pad in which the lead is "rippled," that is, formed with undulations each of which engages the surface of the pad so that during soldering, the molten solder fills the spaces between the pad and the lead and then solidifies forming the soldered joint.

REFERENCES:
patent: 3612745 (1971-10-01), Warren
patent: 3643006 (1972-02-01), Ance
patent: 3825801 (1974-07-01), Beavitt
patent: 3855693 (1974-12-01), Umbaugh

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