Soldered integrated circuit connections

Details Soldered integrated circuit connections Soldered integrated circuit connections

1997-12-08

2000-01-11

Gutierrez, Diego

Geometrical instruments

Gauge

Template

101127, 2281801, 118406, G01B 514, F23J 300

Patent

active

060122315

ABSTRACT:
Solder paste is deposited using a solder stencil with an aperture having a concave edge in order to reduce the formation of solder balls. The solder deposit may be formed on a pad such that the paste has a concave edge. Solder paste deposits may be made on adjacent pads with the concave surfaces facing one another.

REFERENCES:
patent: 338621 (1886-03-01), Stines
patent: 950670 (1910-03-01), Krug
patent: 2241380 (1941-05-01), Gfeller
patent: 4270465 (1981-06-01), Lim
patent: 4301189 (1981-11-01), Arai et al.
patent: 4383482 (1983-05-01), Ito
patent: 4982892 (1991-01-01), Parla et al.
patent: 5339536 (1994-08-01), Buttars
patent: 5740730 (1998-04-01), Thompson

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