Soldered heat sink anchor and method of use

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C174S262000, C248S071000

Reexamination Certificate

active

10843408

ABSTRACT:
An anchoring mechanism and method are provided for securing a component to a printed circuit board. The anchoring mechanism may include a loop, a first leg extending from the loop, and a second leg extending from the loop. The first leg may mount through a first hole of the printed circuit board and include a compressible section to compress when inserted into the first hole and to expand after passing through the first hole. The compressible section of the first leg may support solder between the anchoring mechanism and the first hole. Likewise, the second leg may mount through a second hole of the printed circuit board and include a compressible section to compress when inserted into the second hole and to expand after passing through the second hole. The compressible section of the second leg may support solder between the anchoring mechanism and the second hole.

REFERENCES:
patent: 2918240 (1959-12-01), Wiegand
patent: 5115375 (1992-05-01), Garay et al.
patent: 5150865 (1992-09-01), Miller
patent: 5734556 (1998-03-01), Saneinejad et al.
patent: 5881800 (1999-03-01), Chung
patent: 5917701 (1999-06-01), Solberg
patent: 6037660 (2000-03-01), Liu
patent: 6061240 (2000-05-01), Butterbaugh et al.
patent: 6075699 (2000-06-01), Rife
patent: 6181559 (2001-01-01), Seo
patent: 6195880 (2001-03-01), Hinshaw et al.
patent: 6229703 (2001-05-01), Lee
patent: 6246584 (2001-06-01), Lee et al.
patent: 6273185 (2001-08-01), Lin et al.
patent: 6273319 (2001-08-01), Ichikawa et al.
patent: 6273327 (2001-08-01), Murray, Jr. et al.
patent: 6284981 (2001-09-01), Hwang
patent: 6313993 (2001-11-01), Hinshaw et al.
patent: 6434004 (2002-08-01), Matteson
patent: 6492202 (2002-12-01), Lober et al.
patent: 2002/0039285 (2002-04-01), Hsieh et al.
patent: 1020910 (2000-07-01), None

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Soldered heat sink anchor and method of use does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Soldered heat sink anchor and method of use, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Soldered heat sink anchor and method of use will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3835065

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.