Metal fusion bonding – Process – Mechanically joining metal/nonmetal and bonding to the metal
Patent
1998-08-19
2000-10-10
Ryan, Patrick
Metal fusion bonding
Process
Mechanically joining metal/nonmetal and bonding to the metal
228193, 228175, B23K 3102, H05K 338
Patent
active
061292605
ABSTRACT:
Solderable structures, and related methods for making them, can provide thermal conductivity and/or electrical isolation for electronic devices soldered to the structures. Each of the structures includes a solderable material bonded to a heat sink by a thermally-activated bonding material which provides thermal conductivity between the solderable material and the heat sink and which can be configured as a three-layer bonding film to also provide electrical isolation. The structures can be produced in a highly-automated, rapid way without the need for standard mounting hardware and mechanical preparation of the heat sinks.
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Andrus Lance
Barrett Edward
Fraivillig James
High Brian
Fravillig Technologies Company
Johnson Jonathan
Ryan Patrick
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