Solderable solventless UV curable enamel

Details Solderable solventless UV curable enamel Solderable solventless UV curable enamel

1980-04-24

1982-12-07

Cannon, James C.

Metal fusion bonding

Process

Critical work component, temperature, or pressure

174110E, 20415914, 219 85M, 219129, 427 541, 427117, 430280, 428379, B05D 306, B32B 1508, H01B 340

Patent

active

043622631

ABSTRACT:
A solderable solventless UV curable enamel is disclosed which comprises a totally saturated compound having at least two rings each containing an epoxy group and a UV curative which generates a cation in the presence of UV light. The enamel contains no Lewis base but may contain up to 35% by weight based on total solids of a modifying resin which is co-reactive with the totally saturated compound and which does not char or prevent UV cure. The enamel is suitable for coating wires which must be soldered because the enamel melts away from the solder instead of charring.

REFERENCES:
patent: 4000115 (1976-12-01), Jacobs
patent: 4086091 (1978-04-01), Cella
patent: 4090936 (1978-05-01), Barton
patent: 4138255 (1979-02-01), Crivello
patent: 4173476 (1979-11-01), Smith
patent: 4186108 (1980-01-01), Carlson
patent: 4218531 (1980-08-01), Carlson
patent: 4256828 (1981-03-01), Smith

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