Solderable polymer thick films

Details Solderable polymer thick films Solderable polymer thick films

1984-05-21

1985-10-22

Silverberg, Sam

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

252512, 252513, 427216, H01B 100

Patent

active

045488797

ABSTRACT:
This invention discloses conductive compositions having improved solderability. These compositions contain metal and/or alloys thereof coated with saturated monocarboxylic acid which is dispersed in an organic polymeric matrix. Also disclosed is a method for preparing these conductive compositions. Another embodiment of the invention is a method of coating metal and/or alloys thereof with carboxylic acid.

REFERENCES:
patent: 2683676 (1954-07-01), Perlman
patent: 4152386 (1979-05-01), Winter
patent: 4331714 (1982-05-01), Tyran
patent: 4333966 (1982-06-01), Deffeyes

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