Solderable plated plastic components and process for plating _

Details Solderable plated plastic components and process for plating _ Solderable plated plastic components and process for plating _

1983-05-31

1985-01-22

O'Keefe, Veronica

Stock material or miscellaneous articles

All metal or with adjacent metals

Composite; i.e., plural, adjacent, spatially distinct metal...

428620, 428419, 427304, B29D 302, B32B 1508

Patent

active

044952538

ABSTRACT:
A particular plastic material is formed into the desired component shape and then is plated by a process comprising; a particular surface preparation step, electroless deposition and electrolytic deposition which results in excellent plating adhesion. The plated component is then assembled with other components manufactured in the same manner or with compatible metal components such as aluminum and soldered together in a disclosed hot oil dip soldering process. In the soldering process, the plated plastic substrate is completely immersed in a hot oil medium at a temperature of approximately 243.degree. C. (470.degree. F.) for a time of approximately 60 seconds for solder reflow.

REFERENCES:
patent: 3681209 (1972-08-01), Campbell et al.
patent: 3953653 (1976-04-01), Doss
patent: 4192764 (1980-03-01), Madsen
patent: 4248921 (1981-02-01), Steigerwald
patent: 4296217 (1981-10-01), Stuart-Webb
patent: 4335164 (1982-06-01), Dillard
Modern Plastics Encyclopedia, pp. 2,3,483,484,493,498,499, 1983-1984.
D. J. Levy et al., Plating & Surface Finishing, pp. 68-71, Jun. 1979.

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