Solderable palladium-nickel coatings and method of making said c

Details Solderable palladium-nickel coatings and method of making said c Solderable palladium-nickel coatings and method of making said c

1983-11-15

1984-07-31

Kaplan, G. L.

Stock material or miscellaneous articles

All metal or with adjacent metals

Composite; i.e., plural, adjacent, spatially distinct metal...

204 43N, 204 351, 228211, 428670, 428671, 428675, 428680, C23C 300, C25D 356, C25D 548, B23K 120

Patent

active

044630603

ABSTRACT:
A permanently solderable palladium-nickel electroplated coating is formed on electrically conductive surfaces. The coating has a first alloy layer of 46 to 82 atomic percent palladium and 18 to 54 atomic percent nickel. This first layer is covered by a continuous second layer of 96 to 100 atomic percent metallic palladium and 0-4 atomic percent nickel. The second layer has a thickness of up to twenty angstroms. The second layer is formed by dipping the first layer in a solution of sulfuric or hydrochloric acid.

REFERENCES:
patent: 4416741 (1983-11-01), Schulze-Berge

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