Metal fusion bonding – Process – Plural joints
Reexamination Certificate
2006-02-28
2010-06-29
Ward, Jessica L. (Department: 1793)
Metal fusion bonding
Process
Plural joints
C228S006200, C228S180100, C156S230000, C174S050610, C257S629000, C257S704000, C257S678000
Reexamination Certificate
active
07743963
ABSTRACT:
A solderable cover for solder attachment to an electronic substrate comprises a non-solderable cover defining an attachment pattern, a solderable metal layer in the shape of the attachment pattern, and a layer of adhesive bonding the solderable metal layer to the attachment pattern of the non-solderable cover, wherein the adhesive exhibits bond strength and resiliency sufficient to maintain the solderable metal layer attached to the non-solderable cover when raised in temperature to a melting temperature of a solder.
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Bernard, Esq. Clement A.
Dann Dorfman Herrell & Skillman, PC
Saad Erin B
Ward Jessica L.
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