Solderable lead

Details Solderable lead Solderable lead

1991-02-26

1992-02-25

Desmond, Eugene F.

Electrical connectors

Metallic connector or contact having part permanently...

Adapted to be secured to conductor formed on printed circuit...

29843, 439 83, H01R 402

Patent

active

050909266

ABSTRACT:
A solderable lead is fashioned with a C-shaped contact portion along its length. The interior of the C-portion is dimensioned to receive and resiliently contact a substrate at a predetermined contact pad. A layer of solder is provided on the exterior of the C-shaped contact portion and extends around its edge. During heating, the solder migrates to the interior of the C-portion by capillary action to the area between the contact pad of the substrate and the interior of the C-portion. While the solder is liquid, the C-portion maintains engagement with the substrate.

REFERENCES:
patent: 4357069 (1982-11-01), Milora
patent: 4900279 (1990-02-01), Dennis

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