Electrical connectors – Metallic connector or contact having part permanently... – Adapted to be secured to conductor formed on printed circuit...
Patent
1993-10-12
1997-07-01
Abrams, Neil
Electrical connectors
Metallic connector or contact having part permanently...
Adapted to be secured to conductor formed on printed circuit...
29843, H01R 402
Patent
active
RE0355496
ABSTRACT:
A solderable lead is fashioned with a C-shaped contact portion along its length. The interior of the C-portion is dimensioned to receive and resiliently contact a substrate at a predetermined contact pad. A layer of solder is provided on the exterior of the C-shaped contact portion and extends around its edge. During heating, the solder migrates to the interior of the C-portion by capillary action to the area between the contact pad of the substrate and the interior of the C-portion. While the solder is liquid, the C-portion maintains engagement with the substrate.
REFERENCES:
patent: 2250156 (1941-07-01), Ferguson
patent: 3324230 (1967-06-01), Sherlock
patent: 3750252 (1973-08-01), Landman
patent: 3780433 (1973-12-01), Lynch
patent: 4019803 (1977-04-01), Schell
patent: 4311267 (1982-01-01), Lim
patent: 4357069 (1982-11-01), Milora
patent: 4396140 (1983-08-01), Jaffe et al.
patent: 4586764 (1986-05-01), Mullen, III et al.
patent: 4718863 (1988-01-01), Sadigh-Behzadi
patent: 4900279 (1990-02-01), Dennis
patent: 5015206 (1991-05-01), Dennis
patent: 5063660 (1991-11-01), Fidelius
"High Purity Precision Alloys", Semi-Alloys Corp, Tech. Bull. CM-64, 4 pp, 1968.
Abrams Neil
North American Specialties Corporation
LandOfFree
Solderable lead does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Solderable lead, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Solderable lead will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-588415