Solderable layer system

Details Solderable layer system Solderable layer system

1988-02-05

1990-02-06

McDowell, Robert

Stock material or miscellaneous articles

All metal or with adjacent metals

Composite; i.e., plural, adjacent, spatially distinct metal...

428632, 428647, B32B 1504

Patent

active

048987913

ABSTRACT:
In a solderable layer system in which a conductor layer which is partially covered with a layer of solder is applied to a support, the solder layer consists of an alloy in which a reducing agent is contained. The alloy is preferably brass.

REFERENCES:
patent: 4424408 (1984-01-01), Elarde
patent: 4441118 (1984-04-01), Fister et al.
patent: 4511634 (1985-04-01), Nickol
patent: 4758474 (1988-07-01), Tsukamoto
Hook, "The Welding of Copper and Its Alloys", Welding Research Supplement, Jul. 1955, pp. 321-337.

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