Solderable elements and method for forming same

Details Solderable elements and method for forming same Solderable elements and method for forming same

1986-04-03

1988-07-12

Godici, Nicholas P.

Metal fusion bonding

Process

With pretreating other than heating or cooling of work part...

428647, 428929, B23K 120

Patent

active

047564679

ABSTRACT:
A wire having enhanced solderability characteristics is formed by applying a very thin uniform coat of silver to a clean copper wire substrate. A coat of tin is plated on top of the silver. Heat treatment causes the silver and tin to form an interface alloy. The device can be other than a wire and the substrate can be other than copper.

REFERENCES:
patent: 1810499 (1931-06-01), Romp
patent: 1904241 (1933-04-01), Kammerer
patent: 2239771 (1941-04-01), Becker
patent: 2294482 (1942-09-01), Siegmund
patent: 2417967 (1947-03-01), Booe
patent: 3097965 (1963-07-01), Wilkins
patent: 3314771 (1967-04-01), Hoffmann et al.
patent: 4391848 (1983-07-01), Hilker
patent: 4441118 (1984-04-01), Fister et al.

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