Solderable contact material

Details Solderable contact material Solderable contact material

1986-10-01

1988-01-12

Smith, John D.

Stock material or miscellaneous articles

Liquid crystal optical display having layer of specified...

With charge transferring layer of specified composition

29843, 228179, 2281801, 2281802, 427 96, 427 99, 427108, 427109, 427110, 428209, 428901, H05K 300

Patent

active

047191341

ABSTRACT:
It is often required to solder an electrical connection to a component or a lead thereto via a contact pad. At present pads are commonly of materials that tend to oxidize during any subsequent heat processing of the device, and are then difficult to solder. It has now been discovered that certain alloys of copper containing manganese may be used to construct contact pads that are both solderable and remain so even when ovened in air at 200.degree. C., and the invention provides a method of constructing solderable contact pads upon a chosen substrate, in which method there is formed on the relevant area of the substrate a layer of such a manganese/copper alloy.

REFERENCES:
patent: 3922385 (1975-11-01), Konantz
patent: 3928658 (1975-12-01), van Bortel
patent: 4229631 (1980-10-01), Arakawa
patent: 4409079 (1983-10-01), Miyazaki
patent: 4436559 (1984-03-01), Fujita
patent: 4540970 (1985-09-01), Kasamatsu

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