Solderable conductor pattern

Stock material or miscellaneous articles – Structurally defined web or sheet – Discontinuous or differential coating – impregnation or bond

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

252514, 428209, 428210, 428434, 428469, 428471, 428472, B32B 1500, H01B 102, H01B 106

Patent

active

042998760

ABSTRACT:
A solderable conductor pattern is formed on a ceramic substrate. The material of the conductor pattern is made by dispersing gold and certain inorganic binders in an inert liquid vehicle composition. Limited variations in the ranges of the amounts of the material in the composition particularly the range in the amount of copper oxide in the binder produce good adhesion of the pattern to fired substrates and simultaneously provide strong solder joints between leads of electronic devices soldered with a lead-indium solder to pads of a pattern of such material after the pattern has been fired on a substrate without the necessity for physically or chemically cleaning the pads. The binders of the material comprise certain amounts of the crystalline materials, copper in the form of its oxides CuO or Cu.sub.2 O, cadmium in the form of CdO, lead in the form of PbF.sub.2, and the balance being a glass which also contains lead and some cadmium.

REFERENCES:
patent: 4004057 (1977-01-01), Hoffman et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Solderable conductor pattern does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Solderable conductor pattern, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Solderable conductor pattern will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2362939

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.