Metal working – Method of mechanical manufacture – Electrical device making
Patent
1980-06-23
1982-10-19
Hall, Carl E.
Metal working
Method of mechanical manufacture
Electrical device making
106 113, 228263R, 252514, H05K 334, H01B 102
Patent
active
043543111
ABSTRACT:
A solderable gold conductor composition is formed by dispersing gold and certain inorganic binders in an inert liquid vehicle composition which can be used to produce conductor patterns which patterns adhere to fired ceramic substrates and to which can be soldered leads of electronic components. Limited ranges in the composition of, and the amount of, the binder particularly the amount of copper oxide are effective to produce adhesion of the composition to fired substrates and in permitting copper leads of electronic devices to be soldered to pads of the gold composition using a lead-indium solder after the composition has been fired on a substrate. Strong solder joints are produced without the necessity for physically or chemically cleaning the pads prior to soldering. The binders comprise certain amounts of the crystalline materials, copper in the form of copper oxides CuO or Cu.sub.2 O, cadmium in the form of CdO, lead in the form of PbF.sub.2 and the balance being a glass which also contains lead and some cadmium.
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patent: 3799890 (1974-03-01), Smith
patent: 3799891 (1974-03-01), Smith
patent: 3809797 (1974-05-01), McMunn et al.
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patent: 3970590 (1976-07-01), Hoffman et al.
Gold Thick Film Conductors in Gold Bulletin Jul. 1977, vol. 10, No. 3 pp. 74-75.
Lam Kit M.
Mones Arthur H.
Neuhoff Donald
Arbes Carl J.
Hall Carl E.
Holloway, Jr. W. W.
Honeywell Information Systems Inc.
Hughes E. W.
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