Solderable conductor

Details Solderable conductor Solderable conductor

1983-09-30

1986-01-14

Kittle, John E.

Stock material or miscellaneous articles

All metal or with adjacent metals

Having metal particles

523458, 252514, 428901, H01B 330

Patent

active

045645639

ABSTRACT:
A solderable electrically conductive composition includes metallic silver particles embedded in a matrix formed from acrylic, carboxylated vinyl and epoxy. The composition is formed by dissolving acrylic powder and vinyl powder in respective solvents to form a first solution and a second solution. The solutions are then mixed with metallic silver particles and an epoxy to form an ink which is applied to a substrate to form a film thereon. The film is cured to evaporate the solvents and allow polymerization to occur thereby leaving a solderable electrically conductive film, formed from metallic silver particles embedded in a matrix containing acrylic, vinyl and epoxy, on the substrate.

REFERENCES:
patent: 2959498 (1960-11-01), Sweeny
patent: 3814703 (1974-06-01), Nakayama et al.
patent: 3932311 (1976-01-01), Caldwell
patent: 4051094 (1977-09-01), Reuter et al.
patent: 4327124 (1982-04-01), DesMarais
patent: 4371459 (1983-02-01), Nazarenko
patent: 4410457 (1983-10-01), Fujimura
patent: 4419279 (1983-12-01), Abrams

Affiliated with

Also associated with

Rating

Solderable conductor does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Solderable conductor, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Solderable conductor will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-430458