Stock material or miscellaneous articles – Structurally defined web or sheet – Discontinuous or differential coating – impregnation or bond
Patent
1981-11-02
1983-08-02
Robinson, Ellis P.
Stock material or miscellaneous articles
Structurally defined web or sheet
Discontinuous or differential coating, impregnation or bond
228121, 252511, 252514, 427226, 427229, 428209, 428210, 428328, 428409, 428413, 428417, 428418, 428901, 428551, B32B 300, B05D 302
Patent
active
043966667
ABSTRACT:
A conductive layer (13) adhesively joined to an electrically inert substrate (10) by an organic binder component. The organic binder consists of a resin not substantially less than 15% nor more than about 35% by weight of the composition which further includes dispersed metallic material within the binder and forming the electrically conductive component of the solderable material. A solderable surface layer (15) of the conductive layer (13) includes exposed metallic material suitable for solder bonding terminations (16) to the conductive layer (13), such solderable surface layer (15) being adhesively joined to the binder by means of the organic matrix.
REFERENCES:
patent: 2700623 (1955-01-01), De Rose et al.
patent: 3671464 (1972-06-01), Gilchrist
patent: 3686139 (1972-08-01), Lubin
patent: 3767519 (1973-10-01), Kojima
patent: 3779807 (1973-12-01), Taylor
patent: 3832242 (1974-08-01), Cuthbert
patent: 3895973 (1975-07-01), Stayner
patent: 3915729 (1975-10-01), Eustice
patent: 3944123 (1976-03-01), Jacobs et al.
patent: 3986889 (1976-10-01), Muntzer
patent: 4025669 (1977-05-01), Greenstein
patent: 4243460 (1981-01-01), Nagler
patent: 4247594 (1981-01-01), Shea
CTS Corporation
Palguta Larry J.
Robinson Ellis P.
Young John A.
LandOfFree
Solderable conductive employing an organic binder does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Solderable conductive employing an organic binder, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Solderable conductive employing an organic binder will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-484128