Solderable conductive employing an organic binder

Details Solderable conductive employing an organic binder Solderable conductive employing an organic binder

1981-11-02

1983-08-02

Robinson, Ellis P.

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

228121, 252511, 252514, 427226, 427229, 428209, 428210, 428328, 428409, 428413, 428417, 428418, 428901, 428551, B32B 300, B05D 302

Patent

active

043966667

ABSTRACT:
A conductive layer (13) adhesively joined to an electrically inert substrate (10) by an organic binder component. The organic binder consists of a resin not substantially less than 15% nor more than about 35% by weight of the composition which further includes dispersed metallic material within the binder and forming the electrically conductive component of the solderable material. A solderable surface layer (15) of the conductive layer (13) includes exposed metallic material suitable for solder bonding terminations (16) to the conductive layer (13), such solderable surface layer (15) being adhesively joined to the binder by means of the organic matrix.

REFERENCES:
patent: 2700623 (1955-01-01), De Rose et al.
patent: 3671464 (1972-06-01), Gilchrist
patent: 3686139 (1972-08-01), Lubin
patent: 3767519 (1973-10-01), Kojima
patent: 3779807 (1973-12-01), Taylor
patent: 3832242 (1974-08-01), Cuthbert
patent: 3895973 (1975-07-01), Stayner
patent: 3915729 (1975-10-01), Eustice
patent: 3944123 (1976-03-01), Jacobs et al.
patent: 3986889 (1976-10-01), Muntzer
patent: 4025669 (1977-05-01), Greenstein
patent: 4243460 (1981-01-01), Nagler
patent: 4247594 (1981-01-01), Shea

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