Solderable conductive compositions having high adhesive strength

Details Solderable conductive compositions having high adhesive strength Solderable conductive compositions having high adhesive strength

1984-07-18

1986-06-17

Barr, Josephine L.

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

427282, 4273935, 4273936, 252514, 524440, 428901, B05D 512, H01B 102

Patent

active

045956065

ABSTRACT:
This invention provides conductive compositions that are directly solderable and that can be bonded directly to substrates. The compositions are made of silver exclusively in the form of flake and a resin system, said resin system comprising phenolic resin, acrylic resin, polyurethane resin, vinyl chloride/vinyl acetate copolymer, epoxy resin and epoxy hardner. By making a mixture of such a complex vehicle system a composition is produced that displays outstanding solderability and adhesion. Also provided is a method of making these compositions.

REFERENCES:
patent: 3412043 (1968-11-01), Gelliland
patent: 3666689 (1972-05-01), Groszek et al.
patent: 4371459 (1983-02-01), Nazarenko
patent: 4410457 (1983-10-01), Fujimura et al.

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