Solderable adhesive layer

Details Solderable adhesive layer Solderable adhesive layer

1984-06-22

1987-04-21

Cannon, James C.

Alloys or metallic compositions

Ferrous

228122, 228123, 22826312, 22826313, 22826314, 420435, 420481, 420117, 420121, C22C 1907, C22C 3810, H01L 2188, H01L 2348

Patent

active

046593780

ABSTRACT:
Electrical contacts to or mechanical connections between components and provided by using a thin layer of an alloy consisting of metals and metalloids. Such a layer shows excellent adhesion to glass or semiconductor substrates.

REFERENCES:
patent: 4038073 (1977-07-01), Handley et al.
patent: 4052201 (1977-10-01), Polk et al.
patent: 4059217 (1977-11-01), Woodward
patent: 4221592 (1980-09-01), Ray
patent: 4527614 (1985-07-01), Matsumoto et al.

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