Solderability test system

Details Solderability test system Solderability test system

1995-04-21

1998-10-27

Brock, Michael

Measuring and testing

Liquid analysis or analysis of the suspension of solids in a...

73 6448, 228103, G01N 1300

Patent

active

058279512

ABSTRACT:
A new test method to quantify capillary flow solderability on a printed wiring board surface finish. The test is based on solder flow from a pad onto narrow strips or lines. A test procedure and video image analysis technique were developed for conducting the test and evaluating the data. Feasibility tests revealed that the wetted distance was sensitive to the ratio of pad radius to line width (l/r), solder volume, and flux predry time.

REFERENCES:
patent: 4467638 (1984-08-01), Greenstein
patent: 4529116 (1985-07-01), Gutbier

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