Metal fusion bonding – Including means to apply flux or filler to work or applicator – Solid flux or solid filler
Patent
1994-06-10
1995-06-06
Heinrich, Samuel M.
Metal fusion bonding
Including means to apply flux or filler to work or applicator
Solid flux or solid filler
228244, 226128, 226162, B23K 306
Patent
active
054215056
ABSTRACT:
A gun-shaped solder-dispensing device dispenses adequate and controlled lengths of solder wire for use in soldering plumbing joints and like tasks. The shape makes it easy to dispense solder and hold it to a heated workpiece all with one hand. The device contains an arcuate toothed drive which comprises about one-quarter of a circle. Thus, it is possible to contain a drive wheel of a large effective diameter in a compact housing. A trigger lever is linked to the drive wheel so that pulling the trigger lever with the fingers of a hand holding the device will dispense a length of solder. The drive wheel acts as a ratchet because it is linked to the trigger lever by pivoting connecting linkages. This allows the toothed wheel to move up into contact with the solder wire before it begins to revolve and move the solder forward. A pressure roller backs the solder to allow a variety of solder diameters to be accommodated. When the trigger lever is released, the drive wheel moves out of contact with the solder before moving to its starting position. Thus, the toothed drive wheel acts as a ratchet and does not move the solder wire in a reverse direction.
REFERENCES:
patent: 2432428 (1946-02-01), Lang
patent: 2751485 (1956-06-01), Sauer
patent: 2952763 (1958-03-01), Gustafsson
patent: 3070057 (1959-07-01), Dezzani
patent: 3101689 (1961-10-01), Hammond et al.
patent: 3707258 (1972-12-01), Schlitt
patent: 3824371 (1974-07-01), Schurman, Jr.
patent: 3852565 (1974-12-01), Kager
patent: 4199096 (1980-04-01), Keefe et al.
patent: 4521673 (1985-06-01), Oury
patent: 4660743 (1987-04-01), Speisebecher et al.
patent: 4746050 (1988-05-01), Brown
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