Solder wave process for solder shunts for printed circuit board

Details Solder wave process for solder shunts for printed circuit board Solder wave process for solder shunts for printed circuit board

2004-10-18

2008-08-12

Stoner, Kiley (Department: 1793)

Metal fusion bonding

Process

Applying or distributing fused filler

C228S037000

Reexamination Certificate

active

07410093

ABSTRACT:
A method of making a printed circuit board having zero resistance connections. Pairs of shunt pads are formed on the board, spaced sufficiently far apart to avoid short circuiting but sufficiently close to permit a solder bridge to occur between them during a solder wave process.

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