Solder wave parameters analyzer

Measuring and testing – Testing of apparatus

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324750, 228 565, B23K 100, B23K 108

Patent

active

053884680

ABSTRACT:
An indicator of solder wave soldering parameters includes a simulating board (10) of electrically insulating material provided with a plurality of electrical contact elements (11A, 11B . . . 18A, 18B) which are located on a first surface of the board (10) such that, when the board is passed by a soldering machine conveyor over a solder wave with the contact elements facing the wave, at least some of them will be immersed in the solder to different depths so as to form an electric contact between them, each of the electrical contact elements being associated with an electronic measuring circuit (31, 33) adapted to measure and record the specific depth and duration of the electrical contact between each such contact element and the solder wave thereby simulating the corresponding dwell time and specific depth of penetration of the solder wave into contact orifices of a real printed circuit plate.

REFERENCES:
patent: 4180199 (1979-12-01), O'Rourke et al.
patent: 4206025 (1980-06-01), Vrancken et al.
patent: 4518646 (1985-05-01), Niclol, Jr.
patent: 4533445 (1985-08-01), Orio
patent: 4816175 (1989-03-01), Lund et al.
patent: 5023848 (1991-06-01), Frey et al.
patent: 5243143 (1993-09-01), Throop et al.
patent: 5244000 (1993-09-01), Stanford et al.

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