Solder wave height set-up gauge

Details Solder wave height set-up gauge Solder wave height set-up gauge

1998-03-04

1999-11-09

Ryan, Patrick

Metal fusion bonding

Including means to apply flux or filler to work or applicator

By partial or total immersion of work or applicator into liquid

228 565, 228 8, 228 33, 228103, H05K 334

Patent

active

059797401

ABSTRACT:
An apparatus for measuring the height of a solder wave having a supporting horizontal member, at least one elongated pin slidably affixed to the horizontal member extending vertically downward. The elongated pins have a sensing means affixed to it and the sensing means communicate with and indicator means to notify a technician the height of a solder wave relative to the top surface of the solder pot. The elongated pins with sensors attached thereto are set up to notify a technician if the solder wave is too low, too high, or at an optimum level. A screw and nut provide height adjustment for the elongated pins.

REFERENCES:
patent: 5409159 (1995-04-01), Connors et al.
patent: 5538175 (1996-07-01), Massini et al.
patent: 5617988 (1997-04-01), Willemen
patent: 5794837 (1998-08-01), Cottingham et al.
patent: 5901899 (1999-05-01), Flache

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