Solder thickness measurement method and apparatus

Details Solder thickness measurement method and apparatus Solder thickness measurement method and apparatus

1986-12-17

1988-05-24

Haroian, Harry N.

Geometrical instruments

Area integrators

Electrical

33172E, G01B 500

Patent

active

047456841

ABSTRACT:
A carrier (36) brings a probe (42) down to the solder surface (28) and a base measurement is taken. The solder is heated to melt the solder and the probe moves down through the liquid solder to the next solid therebelow, and a second position measurement is taken. The base measurement is subtracted therefrom to yield the solder thickness.

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