Metal fusion bonding – Process – Plural joints
Patent
1987-09-29
1989-07-04
Rowan, Kurt
Metal fusion bonding
Process
Plural joints
228 62, 29743, H05K 1304
Patent
active
048443247
ABSTRACT:
A solder system is adapted for use in soldering the terminals of a plurality of circuit boards, to corresponding leads of a plurality of cables. The solder system includes a holding fixture for supporting adjustably the circuit boards relative to the corresponding cablels. A gripper assembly retains the cable leads in position above the corresponding board terminals. A monitor assembly is utilized to supervise optically the various stages of the soldering process. A heater assembly is mounted adjustably above the holding fixture for reflowing the solder material over the aligned cable leads and board terminals.
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IBM Technical Disclosure Bulletin, vol. 21, No. 12, May 1979, p. 5005.
Kleinke Bernard L.
Potts Jerry R.
Rowan Kurt
Waters William Patrick
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