Solder system

Details Solder system Solder system

1977-04-19

1979-10-09

Dean, R.

Specialized metallurgical processes, compositions for use therei

Processes

Free metal or alloy reductant contains magnesium

148 32, 228263, C22C 1300

Patent

active

041704720

ABSTRACT:
A solder system for metallurgically bonding a semiconductor die to a metal package member. The solder is based on the tin rich corner of the tin-antimony-silver ternary alloy system. The solder system has particular applicability to the bonding of power transistors.

REFERENCES:
patent: 2210593 (1940-08-01), McCullough

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