Solder suspension for the application of thin layers of solder t

Details Solder suspension for the application of thin layers of solder t Solder suspension for the application of thin layers of solder t

1994-04-11

1995-07-11

Rosenberg, Peter D.

Metal treatment

Compositions

Fluxing

148 23, B23K 3534

Patent

active

054317452

ABSTRACT:
A solder suspension is disclosed of solder powder, organic binder, organic solvent, and, if necessary, flux, with which it is possible to apply solder layers without cracks and pores to substrates by means of immersion or spraying. The solder powder must have a particle size of 5 to 50 .mu.m, where 55 to 70% of the particles are smaller than the particle size at the maximum on the particle size distribution curve. In addition, the ratio between the average particle size of the solder powder and the density of the solder powder must be between 0.1 and 20.

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patent: 5328521 (1994-07-01), Keusseyan
Office Action Dec. 9, 1993 German PO.

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