Metal fusion bonding – Process – Preplacing solid filler
Patent
1996-12-18
1999-09-14
Ryan, Patrick
Metal fusion bonding
Process
Preplacing solid filler
228254, 228 33, 228 41, B23K 100, B23K 300
Patent
active
059509082
ABSTRACT:
A method of depositing solder paste includes the steps of: superimposing a masking member having a plurality of through-holes and a supporting member on each other so that the supporting member covers the plurality of through-holes; filling cavity portions formed by the plurality of through-holes and the supporting member with solder paste; disposing an LSI chip and the masking member so that electrodes and the cavity portions are superimposed on each other respectively; and heating the solder paste so as to make the solder paste deposit on the electrodes.
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Adachi Akira
Fujino Junji
Hirota Jitsuho
Izuta Goro
Knapp Jeffrey T.
Mitsubishi Denki & Kabushiki Kaisha
Ryan Patrick
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