Solder stripping solution

Details Solder stripping solution Solder stripping solution

1982-09-20

1983-08-09

Powell, William A.

Compositions

Etching or brightening compositions

Inorganic acid containing

134 3, 156345, 156656, 156664, 252 794, 252142, C09K 1308

Patent

active

043977537

ABSTRACT:
Solder stripping solution having an extended life for stripping and removing tin-lead alloy solder or tin deposits from entire circuits or tabs with an insignificant amount of attack on the base epoxy laminate or underlay copper or nickel substrate while leaving a residue-free substrate surface. This solution can be utilized at room temperature or preferably slightly above, and has a prolonged useful life of weeks to months. The composition of the solution includes a hydroxyphenol in an aqueous solution of a nitro-substituted aromatic compound, an inorganic acid, and thiourea.

REFERENCES:
patent: 3677949 (1972-07-01), Brindisi et al.
patent: 4004956 (1977-01-01), Brindisi
patent: 4297257 (1981-10-01), Elias et al.
patent: 4306933 (1981-12-01), DaFonte

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