Solder sleeve having improved heat transfer characteristics and

Details Solder sleeve having improved heat transfer characteristics and Solder sleeve having improved heat transfer characteristics and

1997-04-25

1999-03-30

Heinrich, Samuel M.

Metal fusion bonding

Process

With protecting of work or filler or applying flux

228255, 228 563, H01R 402

Patent

active

058877797

ABSTRACT:
A high performance soldering sleeve having improved heat transfer characteristics. The soldering sleeve has a continuous winding of solder coils positioned within a heat shrinkable tubular member. The solder coils, having a proper flux to solder ratio which increases performance of the soldering sleeve by generating a better solder flow. The solder coils also have better heat adsorption and heat transfer characteristics than prior art solid solder inserts. The solder coils further have the advantage of forming a plurality of lines which provide a fail safe configuration as a visual cue to indicate when a proper amount of heat has been applied to the soldering sleeve.

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patent: 5221815 (1993-06-01), Bostock et al.
patent: 5579575 (1996-12-01), Lamome et al.

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