Solder resist paste and method of soldering

Details Solder resist paste and method of soldering Solder resist paste and method of soldering

1984-10-19

1987-01-06

Ramsey, Kenneth J.

Metal fusion bonding

Process

Using bond inhibiting separating material

228215, 427259, 106 2, B23K 120, B23K 3102

Patent

active

046340394

ABSTRACT:
A solder resist paste having the feature that it is relatively easily removed is disclosed. The paste is comprised of a liquid polyglycol (e.g. Pluronic 25R2 by BASF) and either Kaoline or talc powder. In operation, the paste is selectively applied to holes in the PCB which it is desired to keep open during a soldering process. The paste is then washed out of the holes, additional components mounted via those holes, and soldered into place.

REFERENCES:
patent: 3036118 (1962-05-01), Jackson
patent: 3066390 (1962-12-01), Jack
patent: 3553158 (1971-01-01), Gilfillan
patent: 3899339 (1975-08-01), Peters
patent: 4120843 (1978-10-01), Ameen
patent: 4127692 (1978-11-01), Boynton
patent: 4177303 (1978-12-01), Clipston
patent: 4283480 (1981-08-01), Davies
patent: 4390615 (1983-06-01), Courtney
patent: 4398660 (1983-08-01), Pampalone

Affiliated with

Also associated with

Rating

Solder resist paste and method of soldering does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Solder resist paste and method of soldering, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Solder resist paste and method of soldering will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-678188