Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Reexamination Certificate
2007-04-26
2010-12-28
Lebentritt, Michael S (Department: 2829)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Of specified material other than unalloyed aluminum
C257SE21586, C257SE21596, C257SE23185
Reexamination Certificate
active
07859110
ABSTRACT:
The present invention provides a solder resist material, which can suppress the warpage of a semiconductor package upon exposure to heat or impact even when used in a thin wiring board and meets a demand for size reduction in electronic devices and a higher level of integration, and a wiring board comprising the solder resist material and a semiconductor package. The solder resist material of the present invention can effectively suppress the warpage of a semiconductor package through a fiber base material-containing layer interposed between resin layers. The fiber base material-containing layer is preferably unevenly distributed in the thickness direction of the solder resist material.
REFERENCES:
patent: 4833226 (1989-05-01), Ishimura et al.
patent: 6605353 (2003-08-01), Okada et al.
patent: 6835785 (2004-12-01), Ishii et al.
patent: 7396588 (2008-07-01), Wakizaka et al.
patent: 2001/0056174 (2001-12-01), Okada et al.
patent: 2004/0234741 (2004-11-01), Hosomi et al.
patent: 2008/0033117 (2008-02-01), Ishii et al.
patent: 2009/0205856 (2009-08-01), Ishii et al.
patent: 2009/0266583 (2009-10-01), Nagasaki et al.
patent: 2010/0048826 (2010-02-01), Ishii et al.
patent: 2010/0078201 (2010-04-01), Yoshizaki et al.
patent: 2010/0101843 (2010-04-01), Wakabayashi et al.
patent: 04-221883 (1992-08-01), None
patent: 2003-101244 (2003-04-01), None
patent: 2004-356199 (2004-12-01), None
patent: 2004-356200 (2004-12-01), None
Hirose Hiroshi
Nakamura Kensuke
Ditthavong Mori & Steiner, P.C.
Lebentritt Michael S
Sumitomo Bakelite Co. Ltd.
LandOfFree
Solder resist material, wiring board using the solder resist... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Solder resist material, wiring board using the solder resist..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Solder resist material, wiring board using the solder resist... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4163953