Coating processes – Direct application of electrical – magnetic – wave – or... – Polymerization of coating utilizing direct application of...
Patent
1995-12-06
1997-11-25
Berman, Susan W.
Coating processes
Direct application of electrical, magnetic, wave, or...
Polymerization of coating utilizing direct application of...
522 84, 522 85, 427517, 427519, C08J 704, C08F 400, C08F 250, C08L 3102
Patent
active
056910061
ABSTRACT:
There are disclosed photosensitive compositions based on water as solvent and/or dispersant for the components of said compositions, comprising 10-50% by weight of water-soluble and/or water-dispersible solid, crosslinkable film-forming polymers as binder, 4-50% by weight of water-soluble and/or water-dispersible photopolymerisable acrylate and/or methacrylate monomers and/or corresponding oligomers, 0.1 to 10% by weight of water-soluble and/or water-dispersible photoinitiator compounds for the photopolymerisable acrylate and/or methacrylate monomers and/or corresponding oligomers, and if the binder contains non-selfcrosslinking polymers, 2.5-40% by weight of water-soluble and/or water-dispersible crosslinking agents for the polymeric binder as thermal hardener, selected from the group consisting of epoxy resins, melamine resins and blocked polyisocyanates.
Preferred compositions contain carboxyl group-containing acrylate and methacrylate polymers and copolymers as binder, the carboxyl groups of which composition are reacted with ammonia and/or amines in an amount sufficient to ensure the water-solubility of the polymers and copolymers.
The novel compositions are photoimageable and are particularly suitable for use as solder resists.
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Salvin Roger Pierre-Elie
Schulthess Adrian
Berman Susan W.
Chrichton David R.
Ciba Specialty Chemicals Corporation
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