Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – Distinct contact secured to panel circuit
Reexamination Certificate
2005-12-20
2005-12-20
Gilman, Alexander (Department: 2833)
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
Distinct contact secured to panel circuit
C439S876000
Reexamination Certificate
active
06976855
ABSTRACT:
A solder transfer method which uses an electrically-conductive, e.g., metal, surface, of a stamping or pin or pad as a vehicle to transfer molten solder from a remote solder reserve to a solder joint to be made. In one of the preferred embodiments, a solder deposit previously formed on a surface mount pad during a first reflow step will transfer up to the adjoining contact surfaces by a wicking process to provide the additional solder needed to fabricate a robust solder joint. The method and construction are useful for attaching a daughter board to motherboard, and for surface mounting a long header with multiple pins to the contact surfaces of a PCB without the need to separately add solder during a second reflow step to make a robust solder joint between the contact surfaces.
REFERENCES:
patent: 3601750 (1971-08-01), Mancini
patent: 4500149 (1985-02-01), Mackay
patent: 4646204 (1987-02-01), Brauer
patent: 4655517 (1987-04-01), Bryce
patent: 4663815 (1987-05-01), Hartman et al.
patent: 4797110 (1989-01-01), Ponziani et al.
patent: 4854472 (1989-08-01), Semersky
patent: 4855517 (1989-08-01), Metz et al.
patent: 4877176 (1989-10-01), Kubis
patent: 4884335 (1989-12-01), McCoy et al.
patent: 4943846 (1990-07-01), Shirling
patent: 5033675 (1991-07-01), Shino
patent: 5035656 (1991-07-01), Patel
patent: 5169347 (1992-12-01), Sang
patent: 5641291 (1997-06-01), Sueki et al.
patent: 5656798 (1997-08-01), Kubo et al.
patent: 5816868 (1998-10-01), Legrady et al.
patent: 6011222 (2000-01-01), Sekiya et al.
patent: 6116921 (2000-09-01), Scholz et al.
patent: 6229101 (2001-05-01), Sekiya et al.
patent: 6259039 (2001-07-01), Chroneos et al.
patent: 6402531 (2002-06-01), Legrady
patent: 6402574 (2002-06-01), Cachina et al.
patent: 6623283 (2003-09-01), Torigian et al.
patent: 6644983 (2003-11-01), Recktenwald et al.
patent: 6773269 (2004-08-01), Downes
Eisenberg Donald S.
Kennedy Craig M.
Auto Splice Systems Inc.
Gilman Alexander
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