Solder removing device

Details Solder removing device Solder removing device

1985-04-19

1986-02-25

Godici, Nicholas P.

Metal fusion bonding

With means to remove, compact, or shape applied flux or filler

228264, B23K 100

Patent

active

RE0320862

ABSTRACT:
A solder removing device is disclosed for absorbing solder which has been rendered molten by the application of heat, including an open-mesh structure comprising a strand and formed by knitting, as a primary example, at least the surface of the strand being metallic and receptive to solder flux (and indeed being coated with solder flux rendering it more capable of wetting with molten solder). The open-mesh structure enables the device to absorb solder more freely and in greater quantities than can prior braided devices in which the multiple strands are contiguous.

REFERENCES:
patent: 3715797 (1973-02-01), Jackson et al.
patent: 3726464 (1973-04-01), Howell et al.

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