Metal fusion bonding – With means to remove – compact – or shape applied flux or filler
Reexamination Certificate
2000-06-22
2001-12-04
Dunn, Tom (Department: 1725)
Metal fusion bonding
With means to remove, compact, or shape applied flux or filler
C228S049500
Reexamination Certificate
active
06325270
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to a solder removing apparatus, and more particularly to a solder removing apparatus preferable for removing solder for connection formed on a connection surface of an LSI and the like.
2. Description of the Prior Art
A high density module is used in a computer product such as a large scale computer or a server. A plurality of LSIs are located on a multi-level interconnection substrate constituting a high density module. In the high density module, by connecting each LSI to the multi-level interconnection substrate through ball grid array (BGA) connection in which solder balls are used, the connection density is enhanced. In the LSI having each side of 20 mm, however, a number of solder balls used for connection is approximately 5,000. Therefore, the possibility that connection failure may occur due to unconnected state between the multi-level interconnection substrate and each connection terminal of the LSI is high. In a case where such a connection failure occurs, a repair operation is required such that the LSI is removed from the multi-level interconnection substrate and reconnection is then performed. At the time of this repair operation, since the solder adheres to the connection surface of the LSI removed from the multi-level interconnection substrate, the solder must be first removed. The solder balls are thereafter again formed on the connection surface of the LSI and the LSI is reconnected to the multi-level interconnection substrate.
SUMMARY OF THE INVENTION
In the above-described repair operation, a solder removing apparatus may be used in order to remove the solder in some cases. Here, an example of the solder removing apparatus will be described hereunder as a reference technique.
The solder removing apparatus comprises: a copper plate adsorbing head for carrying a copper plate to a heating stage; an LSI adsorbing head for carrying the LSI onto a heated copper plate; and an X-Y stage for moving each of the unused copper plate, the used copper plate, the LSI, and the heating stage in the X-Y direction. This solder removing apparatus heats the solder adhering to the connection surface of the LSI and causes the fused solder to adhere to the heated copper plate. This can remove the solder adhering on the LSI.
In this solder removing apparatus, the copper plate adsorbing head and the LSI adsorbing head are independently provided at positions distanced from each other. The two adsorbing heads independently move up and down. Further, when the X-Y stage moves in the X-Y direction, carriage of the copper plate or that of the LSI is performed. Thus, it has been found out from the analysis by the inventor that the process for removing the solder from the LSI takes time and the throughput is low.
It is therefore an object of the present invention to provide a solder removing apparatus which can improve the throughput.
To achieve this object, a solder removing apparatus according to the present invention comprises a stage and a head portion. The top face of the stage is a flat surface and the stage can be arbitrarily moved in a direction parallel to the top face. On the stage are arranged a first member supplying portion on which one or more first members are located, a second member supplying portion on which one or more second members are located and a heating portion for heating the members located thereon at an arbitrary temperature.
The head includes a first head and a second head. The first head and the second head can independently move along the same moving axis in a direction vertical to the top face of the stage. The first head adsorbs the first member located on the first member supplying portion and sets the first member on the heating portion. The second head adsorbs the second member located on the second member supplying portion and sets the second member on the first member located on the heating portion. The solder adhering to the second member is fused when heated by the heating portion through the first member and then adheres to the first member. Consequently, the solder is removed from the second member.
With this arrangement, the relative moving distance of the head with respect to the first and second members in the solder removing operation can be shortened, and the time required for the operation can be reduced, thereby improving the throughput.
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Katayama Kaoru
Kuroda Takeshi
Takahashi Takeshi
Watanabe Naoki
Dunn Tom
Hitachi , Ltd.
Johnson Jonathan
Mattingly Stanger & Malur, P.C.
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