Metal fusion bonding – With means to remove – compact – or shape applied flux or filler – By fluid blast or suction
Patent
1975-10-10
1976-10-26
Smith, Al Lawrence
Metal fusion bonding
With means to remove, compact, or shape applied flux or filler
By fluid blast or suction
B23K 300
Patent
active
039879542
ABSTRACT:
A solder removal device has air under pressure supplied thereto. The device has a hollow handle in which is disposed a Venturi structure for creating a vacuum where the vacuum is applied through a solder collection chamber also disposed in the handle and a solder extraction tube in communication with the solder collection chamber and extending outside of the handle. The air discharged from the Venturi structure is directed around the solder collection chamber and out an opening in the handle whereby heat is removed from the solder collection chamber, the heat having been generated by hot air and solder sucked into the chamber. Hence, the device may be used continuously for solder extraction without discomfort to the operator's hand.
A rotatable cover is also provided in the handle for either partially or completely blocking the air discharged from the Venturi structure whereby air is blown outwardly through the suction tube so that a hot air jet suitable for melting solder is effected when the discharge air is partially blocked and a high intensity jet is effected suitable for blowing away loose solder or the like when the discharge air is completely blocked. A trigger is optionally provided on the handle. The trigger actuates valve means disposed within the device so that upon actuation thereof, the air under pressure supplied to the device is applied to the Venturi structure.
REFERENCES:
patent: 3561662 (1971-02-01), Duhaime et al.
patent: 3578948 (1971-05-01), Friend et al.
Baker Joseph J.
Ferguson Jr. Gerald J.
Joyce Margaret
Pace Incorporated
Smith Al Lawrence
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