Metal fusion bonding – Including means to apply flux or filler to work or applicator – Gaseous flux
Patent
1994-04-14
1996-06-11
Ramsey, Kenneth J.
Metal fusion bonding
Including means to apply flux or filler to work or applicator
Gaseous flux
219388, B23K 1012
Patent
active
055248101
ABSTRACT:
A tunnel-type processor for solder flow application of solder connections to circuit elements on a circuit board. The boards with deposited solder are passed through a heating zone and a cooling zone, on a platen. Heated or cooled gas is injected into the zones to maintain a suitable temperature along with the platen. A housing with an exhaust conduit encloses the platen and limits flow of gas from one zone into another. An optional top manifold can be provided to discharge gas into a respective zone.
REFERENCES:
patent: 4938410 (1990-07-01), Kondo
patent: 5069380 (1991-12-01), Deamborsio
patent: 5230460 (1993-07-01), Deamborsio et al.
Mon Donald D.
Ramsey Kenneth J.
Sikama International, Inc.
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