Solder reflow process for soldering shaped articles together

Metal fusion bonding – Process – Bonding nonmetals with metallic filler

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

228124, 228208, 228240, 29600, B23K 100

Patent

active

045910880

ABSTRACT:
A particular plastic material is formed into the desired component shape and then is plated by a process comprising; a particular surface preparation step, electroless deposition and electrolytic deposition which results in excellent plating adhesion. The plated component is then assembled with other components manufactured in the same manner or with compatible metal components such as aluminum and soldered together in a disclosed hot oil dip soldering process. In the soldering process, the plated plastic substrate is completely immersed in a hot oil medium at a temperature of approximately 243.degree. C. (470.degree. F.) for a time of approximately 60 seconds for solder reflow.

REFERENCES:
patent: 3195079 (1965-07-01), Burton
patent: 3214827 (1965-11-01), Phohofsky
patent: 3354129 (1967-11-01), Edmonds, Jr. et al.
patent: 3681209 (1972-08-01), Campbell et al.
patent: 3733694 (1973-05-01), Vlietstra
patent: 3953653 (1976-04-01), Doss
patent: 4187974 (1980-02-01), Mahajan
patent: 4192764 (1980-03-01), Madsen
patent: 4248921 (1981-02-01), Steigerwald
patent: 4296217 (1981-10-01), Stuart-Webb
patent: 4334646 (1982-06-01), Campbell
patent: 4335164 (1982-06-01), Dillard et al.
patent: 4353954 (1982-10-01), Yamaoka
patent: 4358503 (1982-11-01), Homeyer
patent: 4407883 (1983-10-01), Newton
patent: 4410388 (1983-10-01), Oizumi
patent: 4424254 (1984-01-01), Hedrick
patent: 4444836 (1984-04-01), Khattab
patent: 4492730 (1985-01-01), Oishi
patent: 4495253 (1985-01-01), Abel
D. J. Levy and D. H. Ma, Interfacial Bonding of Nickel to Polyamideimide, Plating & Surface Finishing, Jun. 1979, pp. 68-71.
Modern Plastics Encyclopedia, Oct. 1980, vol. 57, Number 10A, pp. 3, 46, 73, 74, 120, 122, 124, 184, 185, 451-454, 546, 552, and 555.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Solder reflow process for soldering shaped articles together does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Solder reflow process for soldering shaped articles together, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Solder reflow process for soldering shaped articles together will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1567652

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.