Metal fusion bonding – Process – Bonding nonmetals with metallic filler
Patent
1984-10-31
1986-05-27
Godici, Nicholas P.
Metal fusion bonding
Process
Bonding nonmetals with metallic filler
228124, 228208, 228240, 29600, B23K 100
Patent
active
045910880
ABSTRACT:
A particular plastic material is formed into the desired component shape and then is plated by a process comprising; a particular surface preparation step, electroless deposition and electrolytic deposition which results in excellent plating adhesion. The plated component is then assembled with other components manufactured in the same manner or with compatible metal components such as aluminum and soldered together in a disclosed hot oil dip soldering process. In the soldering process, the plated plastic substrate is completely immersed in a hot oil medium at a temperature of approximately 243.degree. C. (470.degree. F.) for a time of approximately 60 seconds for solder reflow.
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Ajioka James S.
Mulliner Richard R.
Godici Nicholas P.
Hughes Aircraft Company
Karambelas Anthony W.
McKee C.
Runk Thomas A.
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